Colorado Government Contractors > I C INTERCONNECT LLC

I C INTERCONNECT LLCColorado Springs, Colorado

I C INTERCONNECT LLC
719-533-1030 x102
1025 Elkton Dr Colorado Springs, CO 80907-3539
Fax:719-533-1021

Products & Services

electroless nickle ubm combined with stencil printed solder offers the lowest cost flip chip wafer bumping solution available on the market. wafer level csp, wire bond pad resurfacing and related wafer bumping services.

NAICS Code(s)

334413
Semiconductor and Related Device Manufacturing
334418
Printed Circuit Assembly (Electronic Assembly) Manufacturing
334419
Other Electronic Component Manufacturing

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